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1. Soldering
Recommendation for soldering method is noted below.
lReflow soldering
Rising temperature I
The normal to Preheating temperature
30 s to 60 s
Preheating
140 to 160
60 s to 120 s
Rising temperature II
Preheating to 200
20 s to 40 s
Main heating (cf. The limits of resistance to reflow soldering heat)
Gradual cooling
200 to 100
1 /s to 4 /s
l Flow soldering
narrow 0.65 mm pitch.
l Iron soldering
1Solder at 280 max. and 3 seconds max. with the soldering iron tip.
2The soldering iron tip shall not touch the protective coating of the part.
l Use rosin type flux. Do not use high-activity flux (the chlorine content is 0.2 wt % or more).
l Allow enough preheating so that the difference of soldering temperature and temperature of surface of
the part is 100 or less. This temperature difference shall be kept in rapid cooling by immersion into
solvent.
characteristics. Avoid excessive amount of solder.
2. Cleaning
l Residual flux after board washing may cause solder migration. Carefully check the status of board
washing.
trouble.
3. Others
l
l Do not use the product in dewy atmosphere.
(Reflow soldering shall be within two times.)
Chip Attenuator
nRecommend Land Pattern
Dimensions
(mm)
a
b
c
d
0.5
0.35 to 0.4
0.3
1.4 to 1.5
Safety Precautions
Precautions and recommendations are described below.
lPlease inquire with us when you use the different conditions.
lPlease measure a temperature of terminations and study the solderability for every type of board before using.
l Use of more solder results in more mechanical stress to the part resulting in cracking or impaired
Study the type and amount of flux to be used when no washing is made. Study the type of water-soluble flux
and cleaning agent and drying condition when water washing is done. Confirm they will not cause any
Take necessary precautions to avoid any abnormal stress caused by bending of board.
We cannot recommend the flow soldering, because a solder bridge may occur owing to
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